VHF/UHF Low-Noise Amplifiers
Table 4. MAX2665 Typical Noise Parameters V CC = 2.7V, T A = +25 N C, Z 0 = 50 I
FREQUENCY (MHz)
60
90
120
150
180
210
240
FMIN (dB)
0.911
0.928
0.940
0.949
0.958
0.967
0.975
| G OPT |
0.1390
0.1458
0.1592
0.1766
0.1962
0.2170
0.2383
G OPT ANGLE
34.5
47.2
58.1
67.0
74.5
80.7
86.2
r n *
0.1241
0.1240
0.1237
0.1233
0.1227
0.1221
0.1213
* r n is normalized.
Active Bypass Mode Control
The devices’ RFOUT/CTRL pin is used to control the
bypass mode of the LNA. When set to logic-high through
an external 1k I resistor, the devices’ active mode is
enabled. Conversely, when connected to logic-low,
the devices’ bypass mode is enabled. An external
DC-blocking capacitor should be used to isolate the
control function of this dual-purpose pin (see the Typical
Application Circuit ).
Applications Information
A properly designed PCB is essential to any RF micro-
Table 5. Logic Table
RFOUT/CTRL
High
Low
PROCESS: SiGe BiCMOS
MODE
Active
Bypass
Chip Information
wave circuit. Use controlled-impedance lines on all
high-frequency inputs and outputs. Bypass V CC with
decoupling capacitors located close to the device.
For long V CC lines, it might be necessary to add addi-
tional decoupling capacitors. Locate these additional
capacitors further away from the device package. Proper
grounding of the GND pin is essential. If the PCB uses
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages . Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
a topside RF ground, connect it directly to the GND pin.
For a board where the ground is not on the component
layer, connect the GND pin to the board with multiple
vias close to the package.
PACKAGE
TYPE
4 WLP
PACKAGE
CODE
W40A0+1
OUTLINE
NO.
21-0480
LAND
PATTERN NO.
Refer to www.maxim-ic.com for the MAX2664/MAX2665
S-parameter download, MAX2664/MAX2665 EV kit sche-
matic, gerbers, PADS layout file, and BOM information.
11
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